Assembly Services
SMD Assembly (SMDA) provides precision Surface Mount Device assembly services to meet your requirements. Our specialised equipment and skilled staff provide a high level of service to meet all your expectations - whether you have low cost mass production requirements or expect delivery to military specifications.
SMD Assembly has invested significantly in the highest quality equipment to meet these requirements. Technical experience in this area is essential. Our staff are trained to get the best out of the equipment resulting in high yields. The benefit to you is in your investment of the parts on the PCB and in improved reliability of the finished product.
SMDA's automatic in-line stencil printer ensures solder paste is accurately placed. By having two of the latest ‘pick and place' machines we can handle the most complex tasks and ensure redundancy, so that your production deadlines are met or exceeded, without being compromised. The 14 stage forced convection reflow oven delivers outstanding results even on the most complex printed circuit boards.
Using SMDA components your staff will find soldering of components a breeze, whether you are working in a lead free environment or not. Through-hole assembly completes the PCB process prior to delivery.
Our professional and experienced staff will work with you to ensure yields meet your expectations through our expertise in:
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Precision fine pitch placement of surface mount electronic components.
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Small component placement to 0201 size.
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Ball Grid Array BGA placement.
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Fine pitch QFP placement.
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Double side SMD component placement.
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Dek camera alignment auto stencil paste printing.
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Hi performance triple head component placement machines.
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Multiple camera scanning of components for physical defects prior to placement.
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Lead or Lead Free soldering processes using Heller leading edge technology reflow oven.
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Through hole component placement.
Contact us for more details about how SMD Assembly can meet your electronic component requirements.